IBM is planning mass production of three-dimensional processor

IBM is planning mass production of three-dimensional processor

IBM wants to get together with the technology company 3M a new three-dimensional processor with 100 stacked chips in mass production. IBM hopes this message loud faster and more energy efficient computers. So far, the expensive stack-processors are used only for special applications. Due to the heat development can with the current adhesives but only up to ten planes are stacked without affecting the processor overheats and the thermal interference effects processing power.

"We need a glue can absorb the mechanical stresses and dissipate heat very quickly and is also an excellent insulator," says Bernard Meyerson, vice president of IBM Research, the demands on the new material. 3M will analyze its existing electronic and bonding materials and related develop simulations using the new material, Ming Cheng, Technical Director of the Department of Electronic Materials at 3M.

IBM also plans to expand the manufacturing process. According to Meyerson individual chips should not be stacked, but whole wafers, which are broken down into individual only after 3D processors. Only then will succeed in the commercialization of the new processor type, says Meyerson.

To get the heat generation due to the stacking in the enough grip, but not only improved adhesive materials, Eby Friedman, a professor of electrical engineering is from the University of Rochester to consider. In addition to the packaging also plays a role in the chip design: "You'll have to build themselves into the chips heat sink," said Friedman.